Method for providing an adherent electroless metal coating on an

Details Method for providing an adherent electroless metal coating on an Method for providing an adherent electroless metal coating on an

1982-09-24

1983-09-06

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

204192E, 204192EC, 204192C, 427 98, 427 99, 427306, 427316, H05K 318, H05K 342

Patent

active

044029985

ABSTRACT:
A method of electrolessly plating a substrate having a rubber-modified epoxy surface includes the steps of preheating the substrate and while still warm, sputter etching at least 50A. from its surface. The substrate is then vacuum metalized with an adhesion promoting metal film, coated with a catalytic layer and a metal is electrolessly deposited thereover.

REFERENCES:
patent: 3296099 (1967-01-01), Dinella
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patent: 4056642 (1976-05-01), Saxena
patent: 4057831 (1977-11-01), Jacobs
patent: 4085022 (1978-04-01), Wechsung
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patent: 4160045 (1979-07-01), Longshore
patent: 4166018 (1979-08-01), Chapin
patent: 4193849 (1980-03-01), Sato
patent: 4285800 (1981-08-01), Welty

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