Method for providing alpha particle protection for an integrated

Details Method for providing alpha particle protection for an integrated Method for providing alpha particle protection for an integrated

1982-04-05

1984-08-28

Smith, John D.

Coating processes

Measuring, testing, or indicating

427 5, 427 82, 427378, 427379, 4273855, 427 96, H01L 21312, H01L 2300

Patent

active

044684118

ABSTRACT:
A controlled quantity of a liquid polyimide precursor compound is deposited on the active surface of an integrated circuit die which has been prepared for packaging, and thereafter cured using a two step curing process to develop a polyimide coating of sufficient thickness to provide alpha particle protection for the die once packaged.

REFERENCES:
patent: 3615913 (1971-10-01), Shaw
patent: 3682698 (1972-08-01), Palmer
patent: 4323405 (1982-04-01), Uno
Mukai, et al., "Planar Multilevel Interconnection Technology Employing a Polyimide", IEEE Journal of Solid State Circuits, vol. SC-13, No. 4, Aug. 1978.
Ward, "Alpha Particle Shield", IBM TDB, vol. 22, No. 4, p. 1398, Sep. 1979.

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