Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Patent
1997-09-29
1999-03-30
Picardat, Kevin M.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
438106, H01L 2144, H01L 2148, H01L 2150
Patent
active
058888500
ABSTRACT:
The present invention is a method of providing a protective covering on an electronic package including a first circuitized substrate, a semiconductor chip positioned on and electrically coupled to the first substrate, and a plurality of conductors also on the substrate for electrically connecting the substrate to an external circuitized substrate. In one version, the method comprises covering substantially all of the external surfaces of the substrate, the semiconductor chip and a portion of the plurality of conductors with a protective covering from immersion in a dielectric solution (e.g., TEFLON AF). The coatings can also be applied by brushing, spraying, or chemical vapor deposition. In an alternative embodiment, all of the external surfaces, including all of the conductors, are coated with the protective covering (e.g., to facilitate package shipment or other handling). The resulting electronic packages are also described herein.
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"The Preparation And Properties Of A New Family Of Amorphous Fluoropolymers: Teflon.RTM. AF", by Paul R. Resnick.
Havens Ross Downey
Japp Robert Maynard
Knight Jeffrey Alan
Poliks Mark David
Quinn, deceased Anne M.
Collins Deven
Fraley Lawrence R.
International Business Machines - Corporation
Picardat Kevin M.
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