Method for providing a backing member for an acoustic...

Details Method for providing a backing member for an acoustic... Method for providing a backing member for an acoustic...

2006-09-12

2006-09-12

Kim, Paul D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S592100, C029S602100, C029S609100, C083S025000, C083S042000, C083S103000, C181S171000, C181S172000, C205S119000, C205S122000, C310S326000, C310S327000, C381S396000, C381S398000, C451S005000, C451S041000

Reexamination Certificate

active

07103960

ABSTRACT:
A method is provided for making a backing layer for an ultrasonic matrix array transducer useful in medical imaging and the like. A conductive grid is provided which includes a plurality of micro-contacts each joined together by a common base so that spaces are provided between the free ends of the contacts. A mold for the grid is filled with an acoustically absorbent material such that the absorbent material fills the spaces between the contacts, so as to produce a block when cured. The common base is removed so as to separate the contacts from one another within the block. Further machining exposes the opposite ends of micro-contacts so that a like number of contact faces or pads are provided at opposed surfaces of the backing layer. Improved transducer constructions are also disclosed.

REFERENCES:
patent: 5099459 (1992-03-01), Smith
patent: 5267221 (1993-11-01), Miller David G. et al.
patent: 5331567 (1994-07-01), Gibbons et al.
patent: 5648942 (1997-07-01), Kunkel, III
patent: 08275295 (1996-10-01), None
“A 2.5 MHz 2D array with Z-axis electrically conductive backing”; Greenstein, M.; Lum, P.; Yoshida, H.; Seyed-Bolorforosh, M.S.; Ultrasonics, Ferroelectrics and Frequency Control, IEEE Transactions on Sep. 5, 1997; pp. 970-977.

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