Method for protecting substrates

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156187, 1562739, 1562755, 1562757, 138144, B32B 0108, B32B 3124

Patent

active

060599081

ABSTRACT:
A tape covering for elongate substrates such as metal pipes is provided. At least one edge of the tape is chamfered. and in preferred embodiments the angle of the chamfer is no greater than 25.degree. especially no greater than 7.degree.. In other preferred embodiments the tape comprises a backing layer and an adhesive layer, both of which preferably include a chamfered edge, the chamfer preferably extending through both the backing layer and the adhesive layer. The tape is preferably heat recoverable, and the adhesive, if present, heat activatable. The tape may be installed according to a preferred method of the invention using induction heating, preferably at such high frequency that the ratio of the thickness of the substrate to the skin depth is at least 25:1.

REFERENCES:
patent: 2027962 (1936-01-01), Currie
patent: 3086242 (1963-04-01), Cook et al.
patent: 3502492 (1970-03-01), Spiller
patent: 3597372 (1971-08-01), Cook
patent: 3874418 (1975-04-01), Hielema
patent: 4213486 (1980-07-01), Samour et al.
patent: 4287034 (1981-09-01), Pieslak et al.
patent: 4372796 (1983-02-01), Greuel, Jr.
patent: 4510007 (1985-04-01), Stucke
patent: 4732632 (1988-03-01), Pieslak et al.
patent: 4791966 (1988-12-01), Eilentropp
patent: 4802509 (1989-02-01), Brandolf
patent: 4806400 (1989-02-01), Sancaktar
patent: 4866252 (1989-09-01), Van Loo et al.
patent: 4910059 (1990-03-01), Sancaktar
patent: 4961798 (1990-10-01), Hart et al.
patent: 4965119 (1990-10-01), Sancaktar
patent: 5026451 (1991-06-01), Trzecieski et al.
patent: 5300356 (1994-04-01), Dempster et al.
patent: 5482087 (1996-01-01), Overbergh et al.
patent: 5720834 (1998-02-01), Steele et al.
British Search Report for Application No. GB 9322092.9, Jan. 27, 1993.
International Search Report for Application No. PCT/GB94/02361, Jan. 30. 1995.

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