Method for protecting gallium arsenide mmic air bridge structure

Details Method for protecting gallium arsenide mmic air bridge structure Method for protecting gallium arsenide mmic air bridge structure

1994-09-19

1996-06-11

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29840, 361795, 437209, H05K 330

Patent

active

055243398

ABSTRACT:
In a method for preserving an air bridge structure on an integrated circuit chip, a protective layer is plasma-deposited over the top and sides of the air bridge. A high density interconnect structure is applied over the chip and protective layer. The protective film provides mechanical strength during the application of the high density interconnect structure to prevent deformation. It also prevents any contamination from intruding under the air bridge. More importantly, the protective film only negligibly impedes the performance of the air bridge and therefore does not need to be removed, thereby eliminating the necessity of ablating the HDI structure.

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