Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2007-09-21
2010-12-28
Richards, N Drew (Department: 2895)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S414000, C257S417000, C257S419000, C257S704000, C257S710000, C257S774000, C257S778000
Reexamination Certificate
active
07859093
ABSTRACT:
A method of protecting a micro-mechanical sensor structure embedded in a micro-mechanical sensor chip, in which the micro-mechanical sensor structure is fabricated with a protective membrane, the micro-mechanical sensor chip is arranged so that a surface of the protective membrane faces toward a second chip, and the micro-mechanical sensor chip is secured to the second chip.
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Morrison, David G., “Die and Package Stacking Grow Up, 3-D Package Options Proliferate as Advances in Wafer Thinning and Handling, Wireboning and Materials Squeeze More Silicon Into Smaller Footprints,” Electronic Design, Jun. 24, 3003, 3 pages.
Kenyon & Kenyon LLP
Lee Kyoung
Richards N Drew
Robert & Bosch GmbH
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