Method for protecting electronic circuit components

Metal working – Method of mechanical manufacture – Electrical device making

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29859, 174 522, 174 524, 206720, 26427212, 361818, 428 353, 428 358, 439608, G05K 506, G05K 900, H01L 2156

Patent

active

056898789

ABSTRACT:
An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production. Thus, electronic products can be provided with an assembly having an environment protection capability and EMI shielding capability amenable to reliable and cost effective high volume production.

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"A New Generation Equipment Prectice For Telecom Access Network Electronics" Horma, Raychen Corporation, 1995 IEPS Conference, San Diego, California.

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