Method for programmable laser connection of two superimposed con

Details Method for programmable laser connection of two superimposed con Method for programmable laser connection of two superimposed con

1989-03-02

1990-01-09

James, Andrew J.

357 49, 357 55, 357 71, H01L 2702, H01L 2906, H01L 2348

Patent

active

048931675

ABSTRACT:
An integrated circuit is provided having super imposed metal strip conductor portions separated by dielectric layers, the conductor portions being provided with upper and lower films of a material having a higher melting temperature than that of the conductor material, the integrated circuit having connections linking predetermined superimposed conductor portions through the dielectric layers, the connections being made by joining beads formed in a laser beam programmed opening. A method for establishing a connection of this type is also provided which includes applying a laser beam to make an opening through an insulating layer, the upper conductor, the dielectric layer, and a portion of the lower conductor, and forming a connection in the opening by selectively controlling the power, the diameter, the number and duration of pulses of the laser beam such that beads are formed beginning at the two conductors which unite to form the connection.

REFERENCES:
patent: 4413272 (1983-11-01), Mochizuki et al.
patent: 4531144 (1985-07-01), Holmberg
patent: 4659427 (1987-04-01), Barry et al.
Smith et al., "Laser Induced Personalization & Alterations of LSI & VLSI Circuits", Proceedings of the First Intern.
Laser Processing Conf., Nov. 16-17, 1981, Anaheim, Calif., Laser Institute of America.
Wei-Wha WU; "Automated Welding Customizes Programmable Logic Arrays", July, 1982, Electronics Intl., Vol. 55, No. 14, pp. 159-162.
Platakis; Mechanism of Laser-Induced Metal Semiconductor Electrical Connections in MOS Structures, J. Appl. Phys., 47:5, May, 1976.
Raffel et al.: Laser Programmed Vias for Restructurable VLSI; IEEE 1980.

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