Method for production of semiconductor package

Details Method for production of semiconductor package Method for production of semiconductor package

2006-01-31

2006-01-31

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S127000, C438S692000, C438S114000, C438S107000, C438S106000, C438S460000, C438S612000, C438S613000

Reissue Patent

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RE038961

ABSTRACT:
The invention provides a method for producing semiconductor packages comprising the steps of forming electronic circuits for a plurality of semiconductor chips11on a wafer1,forming bumps2on the plurality of semiconductor chips11,encapsulating the circuit-forming surface111of the wafer1and the bumps2with a sealant by screen printing means to form a sealant layer4,curing the sealant layer4,grinding the surface of the sealant layer4until the upper end surface of the bump2becomes exposed, placing solder balls on said upper end surface of bumps2to weld the balls to the surface thereof, and dicing the wafer1and the sealant layer4as united into individual semiconductor chips11.Screen printing means is used to encapsulate the entire surface of the wafer with a resin, so that the equipment costs can be markedly reduced as compared with conventional methods using a mold.

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