Method for production of printed circuits by electroless metal p

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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Details

427 97, 427304, 427305, 427307, 427259, 427282, 156668, C23C 302

Patent

active

042935920

ABSTRACT:
A method is provided for producing printed circuits by electroless deposition of metal on an insulating substrate to form a circuit film which comprises contacting an insulating substrate having initiator on a negative pattern of a thermo-setting resin whose activity for deposition of initiator for electroless metal plating is substantially reduced and on a positive pattern for circuit with an aqueous solution of an organic acid and hydrochloric acid and/or nitric acid before electroless plating the positive pattern by immersing the substrate in an electroless metal plating solution to substantially dissolve and remove the initiator on the surface of said negative pattern.

REFERENCES:
patent: 3202612 (1965-08-01), Nelson
patent: 3269861 (1966-08-01), Schneble et al.
patent: 3443988 (1969-05-01), McCormack et al.
patent: 3506482 (1970-04-01), Hirohata
patent: 3562038 (1971-02-01), Shipley
patent: 3632435 (1972-01-01), Eriksson
patent: 3640765 (1972-02-01), Distefano
patent: 3676213 (1972-07-01), Marton

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