Method for production of microcapsule type conductive filler

Coating processes – Particles – flakes – or granules coated or encapsulated – Solid encapsulation process utilizing an emulsion or...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

42721332, 42721334, 42721336, 252514, 523200, 523202, 523205, 523459, B01J 1320, B05D 714

Patent

active

060804432

ABSTRACT:
A process for producing a MC-type conductive filler includes treating minute metallic particles with a coupling agent, preparing an oil phase of the coupling agent-treated minute metallic particles and a reactive substance A, the reactive substance A directly contacting the metallic particles. Then, an aqueous phase is prepared having a reactive substance B, which is capable of reacting with the reactive substance A, dissolved in water. Thereafter, the oil phase is dispersed in the aqueous phase to form a suspension. In situ reaction of the reactive substances A and B is then caused by applying heat to the suspension or adding a catalyst to the suspension. This forms a coating of a thermosetting insulating resin on the surface of the minute metallic particles. Alternatively, the reactive substance B may not be used. A MC-type conductive filler may also be made by immersing minute metallic particles in an affinity agent, immersing and dispersing the affinity agent treated-particles in an epoxy monomer and polymerizing the monomer to form an insulating polymer on the surface of the minute metallic particles.

REFERENCES:
patent: 3935340 (1976-01-01), Yamaguchi et al.
patent: 3969547 (1976-07-01), Isawa et al.
patent: 4105714 (1978-08-01), Trepka et al.
patent: 4508761 (1985-04-01), Miyoshi et al.
patent: 4620987 (1986-11-01), Yamashita et al.
patent: 4689250 (1987-08-01), Quella et al.
patent: 4833033 (1989-05-01), Sannohe et al.
patent: 4874858 (1989-10-01), Magistro
patent: 5399432 (1995-03-01), Schleifstein et al.
Patent Abstracts of Japan, vol. 17, No. 233 (M-1407) May 12, 1993 (JP 4-362104).
Database WPI, Week 934, AN 93-033291 (JP 4-362104), Derwent Publications Ltd., London, GB.
Database WPI, Week 9220, AN 92-162197 (JP 4-96981), Derwent Publications Ltd., London, GB.
Patent Abstracts of Japan, vol. 14, No. 316 (E-949) Jul. 6, 1990 (JP 2-103874).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for production of microcapsule type conductive filler does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for production of microcapsule type conductive filler, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for production of microcapsule type conductive filler will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1782131

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.