Method for production of electronic circuit board

Details Method for production of electronic circuit board Method for production of electronic circuit board

2005-05-10

2011-10-18

Stoner, Kiley (Department: 1735)

Metal fusion bonding

Process

Preplacing solid filler

C228S180100

Reexamination Certificate

active

08038051

ABSTRACT:
A method for the deposition of a soldering powder to an electronic circuit board includes the steps of imparting stickiness to an exposed metal surface of a substrate and depositing a soldering powder to the resultant sticking part in a liquid body. The method can further include the steps of heating the substrate, thereby fusing the soldering powder, and forming a solder circuit.

REFERENCES:
patent: 4081576 (1978-03-01), Hensel et al.
patent: 5976965 (1999-11-01), Takahashi et al.
patent: 6070788 (2000-06-01), Zakel
patent: 6551650 (2003-04-01), Carre et al.
patent: 2001/0020744 (2001-09-01), Kuramoto et al.
patent: 2003/0091789 (2003-05-01), Koskenmaki et al.
patent: 2003/0209585 (2003-11-01), Katayama
patent: 43 40 396 (1995-06-01), None
patent: 0 595 343 (1994-05-01), None
patent: 1569503 (2005-08-01), None
patent: 2-12830 (1990-01-01), None
patent: 7-7244 (1995-01-01), None
patent: 07-094853 (1995-04-01), None
patent: 09-001382 (1997-01-01), None
patent: 11-8272 (1999-01-01), None
patent: 11-121907 (1999-04-01), None
patent: 11-240612 (1999-09-01), None
patent: 2000-82873 (2000-03-01), None
patent: 2003-37217 (2003-02-01), None
“Powder Technology Handbook”, edited by Society of Powder Technology, Japan, The Nikkan Kogyo Shimbun, Ltd., No. 1, pp. 14-23 (1986).

Affiliated with

Also associated with

Rating

Method for production of electronic circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for production of electronic circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for production of electronic circuit board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4278912