Method for production of contactless chip cards and for...

Details Method for production of contactless chip cards and for... Method for production of contactless chip cards and for...

2008-07-22

2008-07-22

Smith, Zandra (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S113000, C438S118000, C438S462000, C438S464000

Reexamination Certificate

active

07402460

ABSTRACT:
Method of producing electrical units consisting of chips with contact elements, wherein the contact elements are suited for the direct connection with contact terminals of external electric components in an electrically conductive manner, wherein the connection of the contact elements with the chips is effected before the individual chips are removed from the grouping predefined by the wafer and consisting of rows and columns, and the contact elements are made of a metallized plastic foil or metallic foil to be applied onto the chips.

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