Method for production of a nitride semiconductor laminated...

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Reexamination Certificate

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C257S099000

Reexamination Certificate

active

07923742

ABSTRACT:
A nitride semiconductor laminated structure comprises: a substrate; a first p-type nitride semiconductor layer formed using an organometallic compound as a Group III element source material, a p-type impurity source material, and ammonia as a Group V element source material, with the hydrogen concentration in the first p-type nitride semiconductor layer being 1×1019cm−3or less; and a second p-type nitride semiconductor layer on the first p-type nitride semiconductor layer formed using an organometallic compound as a Group III element source material, a p-type impurity source material, and ammonia and a hydrazine derivative as Group V element source materials, with the carbon concentration in the second p-type nitride semiconductor layer being 1×1018cm−3or less.

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