Method for production and apparatus for production of...

Details Method for production and apparatus for production of... Method for production and apparatus for production of...

2007-07-24

2007-07-24

Sells, James (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With work feeding or handling means

C156S543000, C156S582000

Reexamination Certificate

active

10847373

ABSTRACT:
A process for production and apparatus for production of an adhesive wafer which produce a wafer with an adhesive coated well over the entire back surface using a die attach film, wherein the wafer is placed on a table having substantially the same planar shape as the planar shape of the wafer and the entire back surface is heated, the die attach film is pressed against the back surface, and the separation film is peeled off from the wafer in the state with the adhesive heated through the wafer.

REFERENCES:
patent: 5106450 (1992-04-01), Freisitzer et al.
patent: 5472554 (1995-12-01), Ko et al.
patent: 6715524 (2004-04-01), Chen et al.

Affiliated with

Also associated with

Rating

Method for production and apparatus for production of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for production and apparatus for production of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for production and apparatus for production of... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3817503