Method for producing wafer for backside illumination type...

Details Method for producing wafer for backside illumination type... Method for producing wafer for backside illumination type...

2011-06-14

2011-06-14

Nguyen, Ha Tran T (Department: 2829)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Thinning of semiconductor substrate

C438S455000, C257SE21122, C257SE21567

Reexamination Certificate

active

07960249

ABSTRACT:
A wafer for backside illumination type solid imaging device having a plurality of pixels inclusive of a photoelectric conversion device and a charge transfer transistor at its front surface side and a light receiving surface at its back surface side is produced by a method comprising a step of forming a BOX oxide layer on at least one of a wafer for support substrate and a wafer for active layer, a step of bonding the wafer for support substrate and the wafer for active layer and a step of thinning the wafer for active layer, which further comprises a step of forming a plurality of concave portions on a bonding face of the BOX oxide layer to the other wafer and filling a polysilicon plug into each of the concave portions to form a composite layer before the step of bonding the wafer for support substrate and the wafer for active layer.

REFERENCES:
patent: 7262486 (2007-08-01), Kawano et al.
patent: 2002/0173118 (2002-11-01), Dietrich et al.
patent: 2009/0309190 (2009-12-01), Nevin et al.
patent: 4-304653 (1992-10-01), None
patent: 2007-013089 (2007-01-01), None
patent: 2007-059755 (2007-03-01), None
patent: 200180335 (2001-08-01), None
Notice to File a Response mailed Mar. 9, 2011, issued in corresponding Korean Application No. 10-2009-0083990, filed Jul. 9, 2007, 6 pages.

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