Method for producing vertical bipolar transistors and...

Active solid-state devices (e.g. – transistors – solid-state diode – Bipolar transistor structure – Plural non-isolated transistor structures in same structure

Reexamination Certificate

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C257SE27055, C257SE27056, C438S340000, C438S342000

Reexamination Certificate

active

07495312

ABSTRACT:
A method for producing vertical bipolar transistors having different voltage breakdown and high-frequency performance characteristics on a single die comprises forming, for each of the vertical bipolar transistors, a buried collector region, and base and emitter regions above the buried collector region. The lateral extensions and locations of the base and emitter regions and of the buried collector region are, for each of the vertical bipolar transistors, selected to create an overlap between the base and emitter regions, and the buried collector region, as seen from above, wherein at least some of the overlaps are selected to be different.

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Gilbert et al., “Quasi-Dielectrically Isolated Bipolar Junction Transistor with Subcollector Fabricated Using Silicon Selective Epitaxy”, IEEE Transactions on Electron Devices, New York, vol. 38, No. 7, Jul. 1991, pp. 1660-1665, (6 pages).
Heinemann et al., “Novel Collector Design for High-Speed SiGe: C HBTs”, International Electron Devices Meeting 2002, Technical Digest, 2002, pp. 775-778, (4 pages).

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