Method for producing tight pitched coil with reduced...

Details Method for producing tight pitched coil with reduced... Method for producing tight pitched coil with reduced...

2008-10-02

2011-11-01

Van, Luan (Department: 1724)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

C360S123010

Reexamination Certificate

active

08048281

ABSTRACT:
Methods for fabricating thin film magnetic head coil structures are disclosed. The methods disclose deposition of a first thick seed layer, followed by deposition of an ultra-thin second seed layer. Coil structures having sub-micron pitch and high aspect ratios are deposited on the second ultra-thin seed layer, which is removed from between the coil windings via an isotropic etch process such as wet etching or RIE. Subsequent to selective removal of the ultra-thin second seed layer, the first thick seed layer is utilized to deposit pole and backgap structures, eliminating the need to deposit (and remove) a subsequent seed layer on the coil structure.

REFERENCES:
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patent: 6696226 (2004-02-01), Dinan et al.
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patent: 2002/0093762 (2002-07-01), Hsiao et al.
patent: 2006/0034012 (2006-02-01), Lam et al.
patent: 2008/0149490 (2008-06-01), Bonhote et al.

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