Method for producing thin layers on a specific support and...

Details Method for producing thin layers on a specific support and... Method for producing thin layers on a specific support and...

2005-09-06

2005-09-06

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S458000, C438S459000, C438S960000

Reexamination Certificate

active

06939782

ABSTRACT:
The invention relates to a method for producing a thin layer (8) containing at least one component (6, 6A,6B) comprising:—a preparation step, wherein an added layer (2, 3, 4) is created on a support (1), at least one part (2) of said layer being adapted for local embrittling and said substrate and the part which can be embrittled being made from different materials and/or having different microstructures; an embrittlement step, wherein a fragile underlayer (5) is produced in the part which can be embrittled; a work step, wherein at least one component (6, 6A,6B) is created on said added layer; and a separation step, wherein a dissociation is induced in the part which can be embrittled, along said fragile underlayer, in order to produce a thin layer (8) comprising a part of said added layer and said component.

REFERENCES:
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patent: 11-233449 (1999-08-01), None
patent: WO 01/11930 (2001-02-01), None

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