Method for producing thin film multilayer wiring board

Stock material or miscellaneous articles – Composite – Of polyimide

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29852, 174259, 174266, 428354, 428355, B32B 712, B32B 2700

Patent

active

057077495

ABSTRACT:
A thin film multilayer wiring material excellent in reliability, yield, productivity, and higher positioning accuracy includes an insulation organic film having a wiring pattern on one surface and an adhesive layer on another principal surface. The insulation organic film is a polyimide film having a heat resistance at a pyrolysis beginning temperature of 350.degree. to 550.degree. C., a dielectric constant of 3.5-2.2 and a flame retardance of V-0 or V-1 according to the UL-94 standard. The adhesive layer contains an ether bismaleimide compound.

REFERENCES:
patent: 3436819 (1969-04-01), Lunine
patent: 4933045 (1990-06-01), DiStefano et al.
patent: 5055343 (1991-10-01), Murphy
Jap-A-2-45998; Feb. 15, 1990 Hitachi K.K.
J.P.-A-2-94594 Apr.05, 1990 Hitachi Ltd.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for producing thin film multilayer wiring board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for producing thin film multilayer wiring board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for producing thin film multilayer wiring board will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-324788

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.