Stock material or miscellaneous articles – Composite – Of polyimide
Patent
1995-06-26
1998-01-13
Zirker, Daniel
Stock material or miscellaneous articles
Composite
Of polyimide
29852, 174259, 174266, 428354, 428355, B32B 712, B32B 2700
Patent
active
057077495
ABSTRACT:
A thin film multilayer wiring material excellent in reliability, yield, productivity, and higher positioning accuracy includes an insulation organic film having a wiring pattern on one surface and an adhesive layer on another principal surface. The insulation organic film is a polyimide film having a heat resistance at a pyrolysis beginning temperature of 350.degree. to 550.degree. C., a dielectric constant of 3.5-2.2 and a flame retardance of V-0 or V-1 according to the UL-94 standard. The adhesive layer contains an ether bismaleimide compound.
REFERENCES:
patent: 3436819 (1969-04-01), Lunine
patent: 4933045 (1990-06-01), DiStefano et al.
patent: 5055343 (1991-10-01), Murphy
Jap-A-2-45998; Feb. 15, 1990 Hitachi K.K.
J.P.-A-2-94594 Apr.05, 1990 Hitachi Ltd.
Akahoshi Haruo
Fujisaki Kouji
Katagiri Jun'ichi
Kobayashi Fumiyuki
Mukoh Akio
Hitachi , Ltd.
Zirker Daniel
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