Method for producing thin dice from fragile materials

Details Method for producing thin dice from fragile materials Method for producing thin dice from fragile materials

1996-02-07

2000-07-04

Picardat, Kevin M.

Semiconductor device manufacturing: process

Semiconductor substrate dicing

438464, 438416, H01L 21301, H01L 2146, H01L 2178

Patent

active

060838116

ABSTRACT:
Thin dice of fragile material are formed by making saw cuts in a front surface of a body of fragile material. The saw cuts define the thin dice, and have a depth equal to the desired thickness of the thin dice plus about 1 mil. A support film is then applied to the front surface of the body of fragile material. Using conventional equipment, the back surface of the body of fragile material, opposite the front surface, is ground. The grinding operation reduces the thickness of the body to the desired thickness for the thin dice. Due to the depth of the saw cuts, the grinding process exposes these saw cuts creating the individual thin dice having the desired thickness.

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