Etching a substrate: processes – Nongaseous phase etching of substrate – Etching inorganic substrate
Patent
1996-06-07
1997-09-23
Breneman, R. Bruce
Etching a substrate: processes
Nongaseous phase etching of substrate
Etching inorganic substrate
216 43, 216100, 216 95, 216 96, 437192, 437947, 437981, 1566561, H01L 2190
Patent
active
056700628
ABSTRACT:
In accordance with the invention a metal film structure having tapered sidewalls is made by the steps of applying a first layer of metal on a substrate, applying a second layer of a different material over the first layer, forming a pattern of resist on the second layer and etching the first and second layers in an etchant. The material of the second layer is chosen to interact with the metal of the first layer to increase the lateral etch rate of the second layer, thereby producing a metal film structure having tapered sidewalls. In preferred embodiments, the first layer is Cr, the material of the second layer is Mo, and the etchant is ceric ammonium nitrate. The preferred application of the method is to make conductive thin film lines for thin film transistor arrays used in active matrix liquid crystal displays.
REFERENCES:
patent: 3884698 (1975-05-01), Kakihama et al.
patent: 4082604 (1978-04-01), Yanez
patent: 5007984 (1991-04-01), Tsutsumi et al.
patent: 5132745 (1992-07-01), Kwasnick et al.
patent: 5183533 (1993-02-01), Tsutsumi et al.
patent: 5198694 (1993-03-01), Kwasnick et al.
patent: 5242543 (1993-09-01), Maejima et al.
patent: 5324674 (1994-06-01), Possin et al.
patent: 5362660 (1994-11-01), Kwasnick et al.
patent: 5464500 (1995-11-01), Tsujimura et al.
patent: 5554488 (1996-09-01), Rioux
Lin Cheng-Yih
Mulgrew Paul Patrick
Breneman R. Bruce
Lucent Technologies - Inc.
Stein Julie
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