Method for producing superconducting thick film

Superconductor technology: apparatus – material – process – Processes of producing or treating high temperature... – Shaping or consolidating

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505492, 505471, 505500, 505501, 505742, H01L 3924

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active

061436976

ABSTRACT:
A method for producing a superconducting thick film involves the steps of forming a thick layer comprising a superconducting material on a substrate; firing the thick layer formed on the substrate; subjecting the fired thick layer to cold isostatic pressing; and refiring the thick layer subjected to cold isostatic pressing.

REFERENCES:
patent: 5674814 (1997-10-01), Lanagan et al.
"Critical Current Density and Microstructure of Screen-Printed (Bi,Pb).sub.2 Sr.sub.2 Ca.sub.2 Cu.sub.3 O.sub.x Thick Film Sandwiched Between Ag Substrates"; A. Oota, et al.; Applied Physics Letters, U.S., American Institute of Physics, New York, vol. 63, No. 2, p. 243-245.
"Hetero Interfaces of Bi-based Superconductor/Insulator and Electrical Properties"; Sunao Sugihara, et al.; Proceedings of the 1997 4.sup.th International Symposium on Atomically Controlled Surfaces and Interfaces; ACSI-4; Tokyo; Japan; Oct. 27-30, 1997; vol. 130-132, pp. 866-869.
Database WPI; Section Ch, Week 198933; Derwent Publications Ltd., London, GB; Class L03, AN 1989-237607; XP002123568 & JP 01 172218 A (Nippon Kokan KK), Jul. 7, 1989.
Patent Abstracts of Japan; vol. 018, No. 046 (C-1157); Jan. 25, 1994 & JP 05 270826 A (Ishikawajima Harima Heavy Ind. Co., Ltd.); Oct. 19, 1993.

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