Method for producing sputtering target material for Ni-W...

Powder metallurgy processes – Powder metallurgy processes with heating or sintering – Heat and pressure simultaneously to effect sintering

Reexamination Certificate

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Reexamination Certificate

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08080201

ABSTRACT:
There is provided a method for producing sputtering target materials which are used for a Ni—W based interlayer in a perpendicular magnetic recording medium. In this producing method, a Ni—W based alloy powder is prepared as a raw material powder. The alloy powder comprises 5 to 20 at % of W and the balance Ni and unavoidable impurities and is produced by gas atomization. The raw material powder is consolidated at a temperature ranging from 900 to 1150° C. This producing method makes it possible to significantly restrain expansion of the powder-filled billet in the consolidation step, thus efficiently producing Ni—W based sputtering target materials with stable qualities.

REFERENCES:
patent: 6174598 (2001-01-01), Suzuki et al.
patent: 7560066 (2009-07-01), Zhou et al.
patent: 7605481 (2009-10-01), Yamakoshi et al.
patent: 2003/0031928 (2003-02-01), Beteille et al.
patent: 2003/0152755 (2003-08-01), Suzuki
patent: 2006/0099126 (2006-05-01), Hosono et al.
patent: 2008/0274371 (2008-11-01), Thieme et al.
patent: 6248378 (1994-09-01), None

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