Method for producing sputtering target for deposition of titaniu

Details Method for producing sputtering target for deposition of titaniu Method for producing sputtering target for deposition of titaniu

1992-02-19

1994-08-30

Walsh, Donald P.

Powder metallurgy processes

Powder metallurgy processes with heating or sintering

Metal and nonmetal in final product

419 28, 419 38, 419 39, 419 66, 75244, 75245, 75249, B22F 302, B22F 310, B22F 312

Patent

active

053425715

ABSTRACT:
Dual phase sputter targets consisting essentially of TiN and Al, methods of manufacture thereof, and cathodic sputtering methods using such targets are disclosed. The targets are prepared by blending TiN and Al powders followed by compaction to full density. The thus compacted materials are optionally sintered and are then formed into the desired target shape. The targets are used in cathodic sputtering processes to form opaque, dark colored decorative and wear resistant coatings.

REFERENCES:
patent: 4636252 (1987-01-01), Yoshimura et al.
patent: 4909841 (1990-03-01), Iyer et al.
patent: 4943319 (1990-07-01), Yanagawa et al.
patent: 4954170 (1990-09-01), Fey et al.
patent: 4961778 (1990-10-01), Pyzik et al.

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