Method for producing solid electrolytic capacitor

Details Method for producing solid electrolytic capacitor Method for producing solid electrolytic capacitor

2005-02-15

2005-02-15

Nguyen, Ha Tran (Department: 2812)

Metal working

Barrier layer or semiconductor device making

Barrier layer device making

C361S523000, C361S540000

Reexamination Certificate

active

06855177

ABSTRACT:
A method for manufacturing large capacitance solid electrolytic capacitors that can be connected direct with semiconductor component, and offer a superior high frequency characteristic. An aluminum foil3is made porous in one of the surfaces, a dielectric layer2is formed on the porous portion, a through hole4is provided in the aluminum foil3at a certain specific location. An insulation layer5is formed to cover the other surface, viz. non-porous surface, of the aluminum foil3and the inner wall surface of through hole4, a solid electrolytic layer6is provided on the dielectric layer2, and a through hole electrode7is formed in the through hole4, and then a collector layer8is formed on the solid electrolytic layer6. The insulation layer5disposed on aluminum foil3is provided with an opening9at a certain specific location, and a connection terminal10is provided at the opening9of insulation layer5and the exposed surface of the through hole electrode7, respectively.

REFERENCES:
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patent: 5377073 (1994-12-01), Fukaumi et al.
patent: 6466430 (2002-10-01), Mido et al.
patent: 6510045 (2003-01-01), Mido et al.
patent: 2-137311 (1990-05-01), None
patent: 409213587 (1997-08-01), None
patent: 11-274002 (1999-10-01), None

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