Method for producing semiconductor wafer

Details Method for producing semiconductor wafer Method for producing semiconductor wafer

1992-11-16

1994-01-18

Rachoba, M.

Abrasive tool making process, material, or composition

Impregnating or coating an abrasive tool

51323, 51 5C, B24B 4900

Patent

active

052790770

ABSTRACT:
In a method for forming a semiconductor wafer with an orientation flat along a cleavage plane, a groove or hole is formed in the substrate on a line along which the substrate is cleaved to form an orientation flat and the substrate is treated to produce a mirrorlike surface. Then, the substrate having the mirrorlike surface is cleaved from the groove or hole to form the orientation flat. Accordingly, edges of the cleavage plane are not rounded due to the surface treatment. In addition, the substrate is easily cleaved along the cleavage plane from the groove or the hole. As a result, a semiconductor wafer having a sharp cleavage plane as an orientation flat is produced with improved yield, and alignment is performed with high precision in a subsequent process, such as photolithography.

REFERENCES:
patent: 4896459 (1990-01-01), Brandt
patent: 5076021 (1991-12-01), Steere, Jr.
patent: 5087307 (1992-02-01), Nomura et al.
patent: 5111622 (1992-05-01), Steere, Jr.
patent: 5117590 (1992-06-01), Kudo et al.
patent: 5185956 (1993-02-01), Steere, Jr.
patent: 5189843 (1993-03-01), Steere, Jr.

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