Metal working – Method of mechanical manufacture – Electrical device making
Patent
1986-08-20
1988-02-16
Briggs, William R.
Metal working
Method of mechanical manufacture
Electrical device making
29832, H05K 330
Patent
active
047246111
ABSTRACT:
A semiconductor module and a producing method thereof are disclosed. The semiconductor module has a cooling chamber storing a heat-conductive material which is contracted by solidification, semiconductor chips mounted on the lower surface of a substrate and dipped in the heat-conductive material, and a substrate frame, mounted on the cooling chamber, for holding the substrate. A small gap having a width h.sub.1 is formed between the semiconductor chips and the solidified heat-conductive material surface due to contraction of the heat-conductive material by cooling and solidification and, thereafter, the semiconductor module is assembled to have a spacer having a thickness t interposed between the cooling chamber and the substrate frame, thereby forming a gap having a size of h.sub.1 +t between the semiconductor chips and the heat-conductive material.
The gap h can be reduced, thus reducing a heat resistance.
REFERENCES:
patent: 2999034 (1961-09-01), Heidenhain
patent: 4439918 (1984-04-01), Carroll et al.
patent: 4467522 (1984-08-01), Marchisi
New International and External Cooling Enhancements for the Air-Cooled IBM 4381 Module, Nov. 1, 1983.
Electrical Design and Analysis of the Air-Cooled Module (ACM) in IBM System/4381, Nov. 1, 1983.
Briggs William R.
NEC Corporation
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