Method for producing semiconductor laser module

Details Method for producing semiconductor laser module Method for producing semiconductor laser module

2000-03-17

2002-02-19

Christianson, Keith (Department: 2813)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Groove formation

Reexamination Certificate

active

06348360

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to a method for producing semiconductor laser modules for integrally forming a laser light emitting portion and an optical fiber supporting groove portion on a substrate which contains an active layer in between cladding layers.
BACKGROUND ART
A semiconductor laser module in which a laser light emitting body and an optical fiber supporting groove are integrated is known as shown in FIG.
1
. For example, on a substrate
10
made of Si, markers
14
are provided for positioning the laser light emitting body
12
on the substrate
10
and an optical fiber supporting groove
16
for fixing an optical fiber
20
to a semiconductor laser module
1
. In this prior art semiconductor laser module, such a method has been employed to provide the laser light emitting body
12
on the substrate
10
that comprises the steps of providing a soldering material
18
, for example, AuSn on the substrate
10
; thereafter, positioning an end portion of the laser light emitting body
12
at the markers
14
; melting the soldering material
18
; and then fixedly mounting the laser light emitting body
12
on the substrate
10
.
Furthermore, the optical fiber
20
was fixedly mounted on the optical fiber supporting groove
16
in order to provide the semiconductor laser module
1
with the optical fiber
20
such that the core portion (not shown) of the optical fiber
20
was opposed to the emitting spot (not shown) of the laser light emitting body
12
.
SUMMARY AND OBJECTS OF THE INVENTION
In the aforementioned prior-art semiconductor laser module, the laser light emitting body
12
required positioning in place on the substrate
10
to allow, thereafter, the laser light emitting body
12
to be fixedly mounted. Accordingly, in the assembly process of the semiconductor laser module, there was an inconvenience wherein the manufacturing process became complicated since a jig had to be prepared beforehand for positioning the laser light emitting body
12
in place on the substrate
10
and thus a process for positioning the laser light emitting body
12
using this jig was required.
In addition, there was also a problem in that it became difficult to appropriately transmit the laser light emitted from the laser light emitting body to an optical fiber when the laser light emitting body
12
had not been positioned in place on the substrate
10
.
In view of the foregoing, an object of the present invention is to provide a method for producing a semiconductor laser module that enables positioning of the optical fiber in an appropriate position without using a jig for positioning the laser light emitting portion, undergoing a process for positioning the laser light emitting portion, or aligning the optical fiber with the laser light emitting portion (alignment free).
The method for producing a semiconductor laser module, according to the present invention, is characterized by comprising a substrate preparation step for preparing a substrate including an active layer between cladding layers; a supporting groove portion formation step for forming a supporting groove portion to support an optical fiber on the substrate; and an electrode formation step for forming an electrode on a substrate surface of an opposing portion which faces the supporting groove portion.
That is, according to the features of the present invention, the production process can be simplified by eliminating the process of positioning the laser light emitting portion on the substrate, and an optical fiber can be positioned on an appropriate position relative to the laser light emitting portion as well.


REFERENCES:
patent: 5355386 (1994-10-01), Rothman et al.

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