Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent
1995-06-07
1998-06-02
Picardat, Kevin
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
438126, H01L 2160
Patent
active
057598746
ABSTRACT:
A method for producing a semiconductor element, comprising treating a lead frame or a semiconductor wafer or a semiconductor chip, or a lead frame and a semiconductor chip in combination, with at least one package crack-preventing compound selected from compounds having a reactive group, acids, derivatives at a group due to which said acid assumes acidity, siloxane derivatives of the formula (I) ##STR1## and compounds having a number average molecular weight of not more than 10,000 and comprising, in their structure, said siloxane derivative; and an adhesive for adhering a wafer, which is usable in said production method. According to the method, package cracks can be significantly prevented.
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Nitto Denko Corporation
Picardat Kevin
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