Method for producing semiconductor device using a vacuum sealing

Details Method for producing semiconductor device using a vacuum sealing Method for producing semiconductor device using a vacuum sealing

1993-05-24

1994-09-13

Chaudhuri, Olik

Metal working

Barrier layer or semiconductor device making

118730, 118733, C23C 1600, H01L 21306, H01L 2168

Patent

active

053465130

ABSTRACT:
A method for manufacturing a semiconductor device using an apparatus including a processing chamber having an opening and capable of being vacuum sealed, a carrier member including a substrate holder, an arm member, and a substrate carrier which vertically reciprocates in the opening of the processing chamber. A vacuum bellows is divided into an upper bellows and a lower bellows that are attached to a hollow flange therebetween. The upper bellows is a double structure having an inner bellows and an outer bellows. An air inlet is formed in the hollow flange and air is introduced through the inlet into a ring-shaped space between the inner bellows and the outer bellows.

REFERENCES:
patent: 4045181 (1977-10-01), Burd et al.
patent: 4213051 (1980-07-01), Struthoff et al.
patent: 4360499 (1982-11-01), Gubitose et al.
patent: 5100502 (1992-03-01), Murdoch et al.

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