Method for producing semiconductor device having a body with a c

Details Method for producing semiconductor device having a body with a c Method for producing semiconductor device having a body with a c

1995-09-11

1997-03-11

Picardat, Kevin

Fishing, trapping, and vermin destroying

437209, 437214, 437217, 437219, H01L 2166

Patent

active

056100809

ABSTRACT:
A semiconductor device includes a semiconductor device body, a ring part, and connecting parts. The semiconductor device body includes a resin package and a plurality of leads extending outwardly from the resin package. The ring part is made of a resin and surrounds the semiconductor device body. The connecting parts are made of a resin and connect the semiconductor device body and the ring part, so that the semiconductor device body is supported by the ring part via the connecting parts.

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patent: 4701781 (1987-10-01), Sankhagowit
patent: 4837184 (1989-06-01), Lin et al.
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patent: 5114880 (1992-05-01), Lin
patent: 5192681 (1993-03-01), Chiu
patent: 5198888 (1993-03-01), Sugano et al.
patent: 5422163 (1995-01-01), Kamiyama et al.

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