Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate
2007-01-23
2007-01-23
Prenty, Mark V. (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
C257S676000
Reexamination Certificate
active
10959437
ABSTRACT:
The method of producing a semiconductor device in which chips are resin-molded, including steps of: preparing frames having front and back surfaces and die pads; preparing an insulation resin sheet having a first and a second surfaces; preparing a resin-sealing metal mold having cap pins; mounting the resin sheet inside the resin-sealing metal mold in such a manner that the second surface of the resin sheet contacts an inner bottom surface of the resin-sealing metal mold; mounting power chips on the surfaces of the die pads; positioning the frames on the first surface of the resin sheet in such a manner that the back surfaces of the die pads contact the first surface of the resin sheet; pressing the die pads toward the resin sheet using the cap pins and fixing the die pads; injecting a sealing resin in the resin-sealing metal mold and hardening the sealing resin; and removing the semiconductor device in which the power chips are molded with the sealing resin out from the resin-sealing metal mold. The resin sheet may include a metal foil which is disposed to the second surface.
REFERENCES:
patent: 2005/0067719 (2005-03-01), Hayashi et al.
patent: 2000-138343 (2000-05-01), None
patent: 2003-0080900 (2003-10-01), None
Korean Office Action dated Apr. 18, 2006.
Funakoshi Nobuhito
Hayashi Ken-ichi
Kawafuji Hisashi
Ozaki Hiroyuki
Takeshita Tatsuyuki
Buchanan & Ingersoll & Rooney PC
Mitsubishi Denki & Kabushiki Kaisha
Prenty Mark V.
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