Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2000-09-01
2002-10-15
Booth, Richard (Department: 2812)
Semiconductor device manufacturing: process
With measuring or testing
Packaging or treatment of packaged semiconductor
Reexamination Certificate
active
06465264
ABSTRACT:
BACKGROUND OF THE INVENTION AND RELATED ART STATEMENT
The present invention relates to a method for producing semiconductor devices, and to a packaging device usable in such a method.
JP-A-3-131048 discloses a burn-in test method in which semiconductor chips are mounted directly on a substrate to be tested on the substrate.
JP-63-204621 discloses an aging test device in which wafers, each including thereon semiconductor chips thereon, are mounted on a container plate to be tested on the container plate by a probe body.
OBJECT AND SUMMARY OF THE INVENTION
An object of the present invention is to provide a method for producing semiconductor devices, and to provide a packaging device usable in the method, whereby each of the semiconductor devices is easily and securely inspected.
According to the present invention, a method for producing semiconductor devices comprises the steps of:
forming electric circuits on a semiconductor wafer,
cutting off the semiconductor wafer to be divided into the semiconductor devices respectively including the electric circuits so that the semiconductor devices are separated away from each other,
mounting a plurality of the semiconductor devices onto a packaging device for keeping a positional relationship among the semiconductor devices, and keeping a positional relationship between the packaging device and each of the semiconductor devices constant with a spacing between the semiconductor devices on the packaging device,
transferring the packaging device, holding thereon the plurality of the semiconductor devices onto an inspection device so that each of the semiconductor devices on the packaging device is inspected on the inspection device, while the positional relationship among the semiconductor devices and the positional relationship between the packaging device and each of the semiconductor devices are kept constant on the packaging device, and
removing the semiconductor devices from the packaging device after each of the semiconductor devices on the packaging device is inspected on the inspection device, so that the semiconductor devices are separated from each other in order to be useable independent of each other.
Since, when the plurality of the discrete semiconductor devices are transferred onto the inspection device and are inspected on the inspection device, the plurality of the discrete semiconductor devices are held in the packaging device so that at least a part of the electrode of each of the semiconductor devices is covered by the packaging device to prevent said part of the electrode from facing to an environment surrounding the packaging device in the thickness direction of the semiconductor devices, the positional relationship among the discrete semiconductor devices and the positional relationship between the packaging device and each of the discrete semiconductor devices are kept constant with the spacing between the discrete semiconductor devices on the packaging device. Each of the discrete semiconductor devices is easily and securely inspected without interference between the semiconductor devices and without any direct damage of either of the discrete semiconductor devices from the environment surrounding the packaging device.
At least one inspection for judging whether or not each of the semiconductor devices is useable after either of a predetermined temperature and/or a predetermined voltage is applied to the each of the semiconductor devices during a predetermined time period and. In addition, an inspection for judging whether or not each of the semiconductor devices performs a predetermined operating characteristic in a redetermined environment condition may be carried out on the inspection device. The method may further comprise the step of selecting the semiconductor devices to be mounted onto the packaging device from the semiconductor devices formed on the semiconductor wafer on the basis of a relationship between an electrical input and an electrical output on each of the semiconductor devices. The selecting step may be carried out after the semiconductor wafer is cut off to be divided into the semiconductor devices or before the semiconductor wafer is cut off to be divided into the semiconductor devices. The number of the semiconductor devices held on the packaging device when the packaging device is transferred onto the inspection device may be smaller than the number of the semiconductor devices formed on the semiconductor wafer.
If all of the semiconductor devices are pressed against the packaging device by an elastic member while each of the semiconductor devices on the packaging device is inspected on the inspection device, the inspection of each of the semiconductor devices is stably carried out while preventing interference between the semiconductor devices. It is preferable for the stable inspection of each of the semiconductor devices that the direction in which all of the semiconductor devices are pressed against the packaging device by the elastic member is opposite to the direction in which an electrically conductive member of the packaging device is pressed against an electrode of the each of the semiconductor devices on the packaging device, in a thickness direction of the semiconductor devices.
The packaging device may be pressed against the inspection device while each of the semiconductor devices on the packaging device is inspected on the inspection device. It is preferable for the stable inspection of each of the semiconductor devices that the direction in which the packaging device is pressed against the inspection device is opposite to the direction in which the electrically conductive member of the packaging device is pressed against the electrode of each of the semiconductor devices on the packaging device.
According to the present invention, a packaging device for holding thereon a plurality of semiconductor devices to be inspected on an inspection device, including a probe to be electrically connected to an electrode of each of the semiconductor devices, comprises,
holes for respectively receiving detachably therein the semiconductor devices to keep a positional relationship among the semiconductor devices and a positional relationship between the packaging device and each of the semiconductor devices constant with a spacing between the semiconductor devices, in a direction perpendicular to the thickness direction of the semiconductor devices, or directions perpendicular to each other and perpendicular to the thickness direction of the semiconductor devices, and
electrically conductive members adapted to be connected respectively to the electrodes of the semiconductor devices, and extending to an exterior of the packaging device so that the probe is connected to each of the electrically conductive members.
Since the semiconductor devices are received respectively by the holes in order to keep the positional relationship among the semiconductor devices and the positional relationship between the packaging device and each of the semiconductor devices constant with the spacing between the semiconductor devices, in a direction perpendicular to the thickness direction of the semiconductor devices, or directions perpendicular to each other and perpendicular to the thickness direction of the semiconductor devices, and the electrically conductive members are connected respectively to the electrodes of the semiconductor devices when each of the semiconductor devices is inspected, and extend to an exterior of the packaging device so that the probe is connected to each of the electrically conductive members, each of the discrete semiconductor devices is easily and securely inspected without interference between the discrete semiconductor devices and without any direct damage of any of the discrete semiconductor devices from the environment surrounding the packaging device.
The ends of the electrically conductive members exposed to the exterior of the packaging device may be more widely distributed over a surface of the packaging device in comparison with an arrangement of the electrodes on the sem
Endo Yoshishige
Hosogane Atsushi
Kanamaru Masatoshi
Kohno Ryuji
Miura Hideo
Booth Richard
Stevenson Andre′ C.
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