Method for producing semiconductor device

Details Method for producing semiconductor device Method for producing semiconductor device

1995-01-25

1997-07-01

Niebling, John

Fishing, trapping, and vermin destroying

H01L 21324

Patent

active

056438397

ABSTRACT:
In a rapid thermal processing (RTP) of a large-diameter wafer, a wafer is heat treated by an upper high-temperature furnace and a lower low-temperature furnace, which are separated from and can be brought into close contact with one another by a relative vertical position adjusting means. The upper high-temperature furnace has an open bottom which is shut by an openable, heat insulating shutter. Height of the apparatus as a whole can be shortened.

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Roozeboom, Fred; Rapid Thermal Processing Systems: A Review with Emphasis on Temperature Control; Jul. 17, 1990.
Singh, R.; School of Electrical Engineering and Computer Science; University of Oklahoma; Rapid Isothermal Processing; Dec. 1, 1987.

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