Method for producing semiconductor device

Fishing – trapping – and vermin destroying

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437248, 148DIG62, H01L 21225

Patent

active

053004531

ABSTRACT:
A method for producing a semiconductor device, is composed of steps of: covering a lower side of a semiconductor wafer with a heavy metal and disposing the semiconductor wafer in a chamber; causing the heavy metal to diffuse into the semiconductor wafer by heating the semiconductor wafer with a heat source having a small thermal capacity; and thereafter, ceasing to heat with the heat source, then charging the chamber with a cooling gas.

REFERENCES:
patent: 4151008 (1979-04-01), Kirkpatrick
patent: 4290188 (1981-09-01), Ichinose et al.
patent: 4503087 (1985-03-01), Russo
patent: 4717588 (1988-01-01), Wilson et al.
patent: 4732874 (1988-03-01), Sparks

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