Method for producing semiconductor device

Plastic and nonmetallic article shaping or treating: processes – Optical article shaping or treating – Composite or multiple layer

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264 19, 26427214, 26427215, 26427217, B29D 1100

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active

056351151

ABSTRACT:
A method for producing a semiconductor device according to the present invention includes the steps of: disposing a functional element in each cavity of a multi-cavity circuit board, the multi-cavity circuit board having a number of cavities opening upward; overlaying a sealing resin sheet with a predetermined thickness containing, as a sealing resin, one of a thermoplastic resin and a thermosetting resin which is melted by heating and is cured by further heating on the multi-cavity circuit board so as to cover all of the cavities thereof; heating and pressurizing the sealing resin sheet on the multi-cavity circuit board so that the sealing resin sheet is melted to be filled in each of the cavities; and curing the molten resin filled in each of the cavities.

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