Method for producing semiconductor components and thin-film...

Details Method for producing semiconductor components and thin-film... Method for producing semiconductor components and thin-film...

2006-08-04

2011-11-15

Pham, Long (Department: 2814)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Subsequent separation into plural bodies

C438S022000, C438S483000, C438S796000

Reexamination Certificate

active

08058147

ABSTRACT:
The invention relates to a method for producing semiconductor components, wherein a layer composite (6) containing a semiconductor material is formed on a growth substrate (1), a flexible carrier layer is applied to the layer composite (6), the flexible carrier layer is cured to form a self-supporting carrier layer (2), and the growth substrate (1) is stripped away. As an alternative, the carrier layer (2) may have a base layer (2b) and an adhesion layer (2a) adhering on the layer composite.

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