Method for producing semiconductor chips

Details Method for producing semiconductor chips Method for producing semiconductor chips

1997-09-30

1999-10-26

Breneman, Bruce

Semiconductor device manufacturing: process

Semiconductor substrate dicing

438464, H01L 21301

Patent

active

059727810

ABSTRACT:
Semiconductor chips are produced from a wafer. The semiconductor chips are separated from one another by etching the wafer all the way through, by a dry etching process, in defined separation zones between the semiconductor chips. Initially, first etching trenches for separating the p-n junctions are etched into the wafer. Then, second etching trenches are etched from the opposite side of the wafer until the individual semiconductor chips are completely separated.

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