Fishing – trapping – and vermin destroying
Patent
1993-01-13
1994-01-04
Hearn, Brian E.
Fishing, trapping, and vermin destroying
437228, 437243, 437974, 148DIG50, 148DIG135, 148DIG28, H01L 21302
Patent
active
052759580
ABSTRACT:
According to a method for producing semiconductor chips, first grooves are formed in a semiconductor wafer at a front surface, dividing the semiconductor water into a plurality of regions, each region including a single device or an integrated circuit; a first metallization layer is formed in the first grooves; the semiconductor wafer is thinned to a desired thickness from the rear surface of the wafer; second grooves are formed in the semiconductor wafer at the rear surface at positions opposite the first grooves, exposing the first metallization layer; a second metallization layer is formed in the second grooves; a metal layer for heat radiation is formed on the rear surface of the wafer but not on the second metallization layer; and the first and second metallization layers in the first grooves are cut with a dicing blade to produce a plurality of semiconductor chips. Burrs of the metallization layers caused by the dicing are small and never protrude beyond the rear surface of the chip, resulting in a reliable junction between the chip and a mounting substrate in a subsequent die-bonding process.
REFERENCES:
patent: 4851366 (1989-07-01), Blanchard
patent: 4978639 (1990-12-01), Hua et al.
patent: 5071792 (1991-12-01), Van Vonns et al.
patent: 5185292 (1993-02-01), Van Vonno et al.
patent: 5204282 (1993-04-01), Truruta et al.
Hearn Brian E.
Mitsubishi Denki & Kabushiki Kaisha
Picardat Kevin M.
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