Method for producing semiconductor chip with adhesive film,...

Details Method for producing semiconductor chip with adhesive film,... Method for producing semiconductor chip with adhesive film,...

2008-10-07

2011-12-06

Wagner, Jenny L (Department: 2891)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

With attachment to temporary support or carrier

C257SE25016

Reexamination Certificate

active

08071465

ABSTRACT:
A method for producing a semiconductor chip with an adhesive film, which includes: preparing a laminate in which a semiconductor wafer, an adhesive film and a dicing tape are laminated in that order, the adhesive film having a thickness in the range of 1 to 15 μm and a tensile elongation at break of less than 5%, and the tensile elongation at break being less than 110% of the elongation at a maximum load, and the semiconductor wafer having a section, for dividing the semiconductor wafer into a plurality of semiconductor chips, which is formed by irradiating with laser light; dividing the semiconductor wafer into a plurality of semiconductor chips without dividing the adhesive film, by expanding the dicing tape; and dividing the adhesive film by picking up the plurality of semiconductor chips.

REFERENCES:
patent: 2006/0128065 (2006-06-01), Inada et al.
patent: 1799126 (2006-07-01), None
patent: 2002-192370 (2002-07-01), None
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patent: 2006-086509 (2006-03-01), None
patent: 2006-203133 (2006-08-01), None
patent: WO 2004/109786 (2004-12-01), None
patent: WO 2008/126718 (2008-10-01), None
Translation of the Preliminary Report on Patentability mailed May 20, 2010, for Application No. PCT/JP2008/068236, filed Oct. 7, 2008.
Chinese Official Action dated Jul. 18, 2011, for CN Application No. 200880110812.4.

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