Method for producing rigid-type multilayer printed wiring board

Details Method for producing rigid-type multilayer printed wiring board Method for producing rigid-type multilayer printed wiring board

1987-05-29

1988-11-01

Eley, Timothy V.

Metal working

Method of mechanical manufacture

Electrical device making

29852, 174685, H05K 336

Patent

active

047809574

ABSTRACT:
A rigid-type multilayer printed wiring board is produced by bonding a multilayer printed wiring sheet substantially comprising a thin insulating resin layer (1), at least one metal foil printed wiring layer (8, 11) and a plurality of conductive holes (7) formed through the two layers onto a metal board (10) through an insulation laminate (9). In according this method, a multilayer printed wiring interlayer sheet consisting of the multilayer printed wiring sheet retaining a printed wiring pattern unprocessed metal foil (2b) on one surface thereof is prepared first. In this case, a given printed wiring has already been processed on the other surface and sometimes in the inner portion of the interlayer sheet. Then, the other surface of the interlayer sheet is bonded to the surface of the metal board through the insulation laminate. Thereafter, a desired printed wiring pattern is formed on the printed wiring pattern unprocessed metal foil (2b) on the one surface of the interlayer sheet.

REFERENCES:
patent: 3795047 (1974-03-01), Abolafia et al.
patent: 4327247 (1982-04-01), Mituhashi et al.
patent: 4496793 (1985-01-01), Hanson et al.
patent: 4528072 (1985-07-01), Kurosawa et al.
patent: 4616413 (1986-10-01), Iliov et al.
patent: 4663208 (1987-05-01), Ninomiya et al.
patent: 4689442 (1987-08-01), Ozaki

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