Method for producing printed wiring boards

Details Method for producing printed wiring boards Method for producing printed wiring boards

2006-06-13

2006-06-13

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S831000, C029S829000, C029S846000, C029S847000, C029S852000, C156S272200, C156S089110, C174S255000

Reexamination Certificate

active

07059039

ABSTRACT:
A method for producing printed wiring boards comprises the steps of perforating through holes at predetermined positions in an adhesive insulator sheet, filling the through holes with a conductive material such as a conductive paste or metal balls, transferring conductive wiring patterns that have been formed on surfaces of releasable supporting sheets onto the surfaces of the adhesive insulator sheet by heat and pressure. Simultaneously, interlayer via-connections are performed by means of the conductive material filled into the through holes.

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N. Fukutomi et al. “Development of Fine Line Printed Wiring Technology by Planted Wiring Pattern Transfer Method” The Institue of Electronics, Information and Communication Engineers, C-II, vol. J72-C-II, No. 4, pp. 243-253 (with English Abstract).

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