Method for producing printed wiring board

Details Method for producing printed wiring board Method for producing printed wiring board

2005-11-17

2008-11-25

Nguyen, Khiem (Department: 2839)

Electrical connectors

Including elastomeric or nonmetallic conductive portion

Adapted to be sandwiched between preformed panel circuit...

C361S792000, C174S257000

Reexamination Certificate

active

07455533

ABSTRACT:
An insulating resin layer50is formed on a surface of a conductor portion2by performing a plating pretreatment to the conductor portion2that has been formed on a surface of a wiring board substrate1, and forming numerous dendrites3on the surface of the conductor portion2using an electroplating or chemical plating method. The insulating resin layer50is then formed by stacking an insulating resin plate50that has a semi-cured adhesive layer40formed thereon in advance on the conductor portion2and the dendrites3, and then applying pressure and raising temperature for laminate bonding.

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