Method for producing printed circuits

Details Method for producing printed circuits Method for producing printed circuits

1980-05-15

1981-08-25

Powell, William A.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

1566591, 156902, 29852, 427 98, B05D 512, C23F 102

Patent

active

042859913

ABSTRACT:
A method for producing printed circuits. An epoxy resin reinforced with glass fiber is used as basis material, coated with copper, drilled and activated. In one embodiment, the circuit diagram is applied after covering the non-desired regions with a resistance, by screen or photo printing. A nickel, cobalt, or nickel-cobalt layer is deposited onto the circuit, the circuit is covered with a solder prevention lacquer, then the eyes and bore holes are covered with copper. Alternatively, after pre-treatment and activation, all areas except the soldering eyes and bore holes are covered with resist, a nickel, cobalt or nickel-cobalt layer is applied, the circuit diagram is printed using a resist, and the eyes and bore hole are treated as above.

REFERENCES:
patent: 3672986 (1972-06-01), Schneble et al.
patent: 3675318 (1972-07-01), Merkenschlager
patent: 3930963 (1976-01-01), Polichette et al.

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