Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1981-03-02
1983-02-22
Smith, John D.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
156631, 156668, 156902, 204 15, 427 98, H05K 318, H05K 342
Patent
active
043748686
ABSTRACT:
A method for producing printed circuit boards with holes having walls provided with a metal coating on base material provided with an adhesive layer which, in turn, is covered by a masking foil composed of plastic material or metal. Following the preparation of the pattern of holes and prior to the removal of the masking foil, the layer of adhesive coating is removed at the edges of the holes by chemical action, so that an annular zone free of adhesive is formed underneath the masking foil. The masking foil is subsequently removed and the metallization of the pattern of conductors and walls of the holes is produced by currentless deposition alone or combined with galvanic precipitation.
REFERENCES:
patent: 3620933 (1971-11-01), Grunwald et al.
patent: 4001466 (1977-01-01), Shaul
patent: 4162932 (1979-07-01), Konicek
patent: 4217182 (1980-08-01), Cross
Alpaugh et al., "Hole Cleaning of High Aspect Ratio Through-Holes in Printed Circuit Boards", IBM TDB 79, No. 8, Jan. 77.
Davey, "Plasma Desmearing", Finishing Industries, Aug. 1981.
Stahl Fritz
Steffen Horst
Kollmorgen Technologies Corporation
Smith John D.
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