Method for producing printed circuit boards

Details Method for producing printed circuit boards Method for producing printed circuit boards

1992-02-13

1993-10-19

Bell, Mark L.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

106 20R, B05D 512

Patent

active

052543617

ABSTRACT:
A method for producing circuit boards with a film having improved printing properties, adhesion, flexibility and heat resistance which comprises applying a liquid printing ink composition comprising an admixture of a solvent, a polyamide-acid and a partially imidized polyamide-acid, then heat to effect drying and curing.

REFERENCES:
patent: 4073788 (1978-02-01), Peterson
patent: 4347306 (1982-08-01), Takeda et al.
patent: 4496794 (1985-01-01), Darms et al.
patent: 4731287 (1988-03-01), Noda et al.
patent: 4839232 (1989-06-01), Morita et al.
patent: 4871619 (1989-10-01), Araps et al.
patent: 5077084 (1991-12-01), Konotsune

Affiliated with

Also associated with

Rating

Method for producing printed circuit boards does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for producing printed circuit boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for producing printed circuit boards will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1350144