Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Patent
1996-12-12
1999-01-19
Nguyen, Nam
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
438 98, 438 57, 136256, H01L 310224
Patent
active
058613242
ABSTRACT:
A photovoltaic element comprising an electrode comprising an electrically conductive core member which is coated with a conductive adhesive fixed on the light incident surface of a photoactive semiconductor layer, via the conductive adhesive, is disclosed.
The conductive adhesive is composed of at least two layers. The softening point of the conductive adhesive layer nearer to the core member is higher than the highest temperature encountered in the manufacture of the photovoltaic element.
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Hasebe Akio
Ichinose Hirofumi
Murakami Tsutomu
Shinkura Satoshi
Ueno Yukie
Canon Kabushiki Kaisha
Nguyen Nam
Tsang Susy
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