Method for producing multi-layer circuit board and resulting art

Details Method for producing multi-layer circuit board and resulting art Method for producing multi-layer circuit board and resulting art

1996-07-15

1997-10-21

Ryan, Patrick

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

4283171, 4283175, 4283179, 428344, 428421, 428901, 174256, 174259, 361748, 361750, B32B 300, B32B 512, B32B 522, H05K 103

Patent

active

056794444

ABSTRACT:
A method for producing a panel of a multi-layer electronic circuit package and resulting article of manufacture is provided comprising the steps of coating a circuitized core material that has been cut into panels with a dielectric material and copper cover sheets; forming circuits from the cover sheets by etching; applying an adhesive polymer across the dielectric material covering the entire area of the panel; applying a cover sheet; drilling the panel to form through-holes and vias; seeding and plating the through-holes and vias with joining metal; applying photo-resist to the panels exposed with an image of the area of the panel to be joined and developed; and etching the cover sheet and the photo-resist away in the area of the panel to be joined to expose the adhesive polymer.

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patent: 5347710 (1994-09-01), Gall et al.
patent: 5358775 (1994-10-01), Horn, III
patent: 5379193 (1995-01-01), Gall et al.

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